Study in Australia: University of Sydney, Lendlease Bradfield Urbanisation Scholarships.

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The University of Sydney Australia, is now accepting applications for the Lendlease Bradfield Urbanisation Scholarships. This scholarship is available for Australian citizens, Australian Permanent Residents, or International Students at the University of Sydney.

The University of Sydney is an Australian public research university in Sydney, Australia. Founded in 1850, it was Australia’s first university and is regarded as one of the world’s leading universities.

Degree Level

Scholarships are available for pursuing undergraduate degree programme.

Available Subject

Scholarships are awarded within the following Faculties/University Schools:

Faculty of Arts and Social Sciences, Faculty of Engineering and Information Technologies, Sydney School of Architecture, Design and Planning and University of Sydney Business School.

Scholarship Benefits

The Scholarship is valued at $10,000 per annum and is tenable for the full-time duration of the recipient’s undergraduate program including combined degree programs.

Eligible Nationalities

Australian and international students are eligible to apply.

Eligibility Criteria

Students enrolled in their first or second year of an undergraduate degree in the following Faculties/University Schools: Faculty of Arts and Social Sciences, Faculty of

Engineering and Information Technologies, Sydney School of Architecture, Design and Planning and University of Sydney Business School.

Applicants must be undertaking studies within one of the above-listed faculties/ University schools and interested in issues related to urbanism including without limitation, urban development, urban planning, urban design, project finance, project and/or facilities management and engineering.

Students must also have a Weighted Annual Mark (WAM) of 65. SAM for first-year students – full-time. Applicants cannot have studied more than 96 credit points in their degree program (including degree combined programs).

Application Procedure

The mode of applying is online.

Complete Online Application.

Deadline: August 5, 2018.